Hoʻomaka a me ka hoʻohana ʻana i nā abrasive daimana

ʻO ka daimana kekahi mea me ka paʻakikī kiʻekiʻe loa ma ke ʻano. He kiʻekiʻe loa kona paʻakikī, thermal conductivity a me ke kūpaʻa ʻana, no laila hoʻohana nui ʻia i ka ʻoihana abrasive. Me ka hoʻomohala ʻana o ka ʻenehana ʻenehana,daimana abrasivesua hoʻomohala mai nā daimana kūlohelohe kuʻuna i nā daimana hana like ʻole a me nā mea hana composite hana, lilo i ʻāpana koʻikoʻi o ke kahua o nā mea superhard, a hoʻohana nui ʻia i nā ʻoihana kiʻekiʻe kiʻekiʻe e like me ka hoʻoponopono mechanical, electronics, optics, a me ka ikehu hou.

Ⅰ. ʻO ka hoʻolauna kumu o nā abrasive daimana

ʻO nā mea abrasive daimanamea pauda a ʻāpana paha i hana ʻia e ka ʻoki ʻana, ka nānā ʻana, a me ka hoʻomaʻemaʻe ʻana i nā daimana maoli a i ʻole nā ​​diamana hana. ʻO kona paʻakikī Mohs a hiki i ka pae 10, ʻo ia ka mea abrasive kiʻekiʻe loa i ʻike ʻia. Ke hoʻohālikelike ʻia me nā abrasives kahiko e like me ka alumini oxide a me ka silicon carbide, ʻoi aku ka nui o ka ʻoki ʻoki a me ke kūpaʻa ʻana o nā mea abrasives, a hiki ke wili a poli i nā mea paʻakikī kiʻekiʻe me ka hana kiʻekiʻe a me ka pōʻino haʻahaʻa.

ʻO nā abrasives Diamond ka nui o nā ʻano penei:

ʻO ka pauda micro daimana: ʻO ka nui o nā ʻāpana mai nā ʻumi microns a i nā nanometer, kūpono no nā ʻano hana polishing kiʻekiʻe.

huila wili daimana / poʻo wili: hoʻohana ʻia no ka wili ʻana a me ka hana ʻana i nā mea paʻakikī.

ʻO ka ʻuala/drill bit: hoʻohana ʻia no ka ʻoki ʻana a me ka ʻeli ʻana i nā mea e like me ka pōhaku, ka seramika, ke aniani, etc.

Diamond grinding fluid/polishing paste: hoʻohana nui ʻia i ka hana ultra-precision i ka uila, optics, mold a me nā ʻoihana ʻē aʻe.

Mea daimana Composite (PCD/PCBN): hoʻohui i ke daimana me ka metala a i ʻole ka matrix matrix e hana i kahi mea paahana hui me ka paʻakikī a me ke kūpaʻa.

Ⅱ. Nā kahua hoʻohana o nā abrasive daimana

1. Ka hana mīkini
Hoʻohana nui ʻia ʻo Diamond abrasives i ka hana ʻana a me ka wili ʻana i nā mea paʻakikī kiʻekiʻe, e like me ka cemented carbide, ceramics, silicon carbide, aniani, ferrite, etc. ʻO ka hoʻohana ʻana i nā huila wili daimana no ka hana ʻana ʻaʻole hiki ke hoʻomaikaʻi wale i ka hana pono a me ka maikaʻi o ka ʻili, akā e hoʻolōʻihi i ke ola o ka mea hana a hōʻemi i ka hoʻololi ʻana o ka mea hana. He kūpono loa ia no nā kaʻina hana hana kiʻekiʻe i hana nui ʻia.

2. ʻOihana uila a me semiconductor
I ka wā o ka hana ʻana i nā mea e like me nā wafer silika, nā substrate sapphire, nā ʻāpana carbide silicon, ke aniani optoelectronic, a me nā mea ʻē aʻe. Hiki i nā abrasives daimana ke hoʻokō i ka submicron a i ʻole ka nanometer-level flatness a me ka ʻeleʻele. Hoʻohana nui ʻia lākou i nā loulou kī e like me ka chip dicing, wafer grinding, a me ka photomask polishing. He mea koʻikoʻi lākou i ka hōʻoia ʻana i ka hana kiʻekiʻe a me nā hua kiʻekiʻe o nā huahana uila.

3. ʻO ka hana Optical
Hoʻohana nui ʻia ka pauka daimana i ka polishing o ke aniani optical, nā puka makani laser, nā lens sapphire a me nā mea ʻē aʻe. Hiki i kāna ʻoki ʻoki maikaʻi a me ka paʻa kemika ke hoʻomaikaʻi maikaʻi i ka maikaʻi o ka hoʻoili ʻana i ke aniani a hoʻokō i kahi ʻili ʻili Ra ma lalo o 10nm. He mea koʻikoʻi ia no ka hoʻokō ʻana i nā ʻaoʻao ultra-smooth a me ka transmittance māmā kiʻekiʻe.

4. Kūkulu a me ka hana pōhaku
Hoʻohana nui ʻia nā ʻili ʻili daimana, nā ʻāpana drill, nā ʻoki uea, a me nā mea ʻē aʻe i ka hana ʻana i nā mea kūkulu hale e like me ka granite, marble, a me ka pā. Ke hoʻohālikelike ʻia me nā mea hana kuʻuna, ʻoi aku ka maikaʻi o nā mea hana daimana i ka ʻoki ʻana i ka wikiwiki, ke ola lawelawe, a me ka ʻoki ʻana i ka maikaʻi, a kūpono loa ia no ka hoʻomaʻamaʻa maikaʻi ʻana i nā mea kūkulu hale kiʻekiʻe.

5. Ka ikehu hou a me ka lewa
Me ka hoʻomohala ʻana o ka ʻenehana ikehu hou, e ulu wikiwiki ana ke koi no nā abrasives daimana i ka hana ʻana i nā ʻāpana pole pākahiko lithium, diaphragms seramika, nā ʻāpana kaʻa uila, etc. Ma ke kahua o ka aerospace, hoʻohana ʻia nā mea hana daimana no ka mīkini pololei ʻana o nā ʻāpana wela wela, nā ʻāpana structural composite, etc., e hoʻomaikaʻi ai i ka hilinaʻi a me ka lōʻihi o nā huahana.

III. Ka hopena

ʻO nā abrasives daimana, ma ke ʻano he kumu waiwai nui no ka hana ʻoihana ʻenehana hou, ke lawe ʻia nei e nā hiʻohiʻona mīkini kiʻekiʻe kiʻekiʻe ma muli o ko lākou mau waiwai kino maikaʻi a me ka hoʻohana ākea. I ka wā e hiki mai ana, me ka holomua mau o ka ʻepekema waiwai a me ka ʻenehana hana hana, e hoʻomau ka ulu ʻana o nā abrasives daimana i kahi ʻoi aku ka hoʻomaʻemaʻe, ka naʻauao a me ka pili o ka nohona, e kōkua ana i ka ʻoihana hana kiʻekiʻe e neʻe i kahi kiʻekiʻe.