ʻO Plate Calcined Alumina polishing powder i hana ʻia me ka pauka alumina ʻoihana kiʻekiʻe e like me ka mea maka, a hana ʻia e kahi kaʻina hana kūikawā.ʻO ke ʻano aniani o ka alumina polishing pauka i hana ʻia he hexagonal pālahalaha e like me ke ʻano tabular, no laila ua kapa ʻia ʻo Platelet Alumina a i ʻole Tabular Alumina.
ʻO Platelet Alumina kahi ʻano alumina abrasive pauka kiʻekiʻe, i loaʻa i kahi aniani ʻano pāpaʻi o Al2O3 me ka maʻemaʻe o 99.0%.Loaʻa iā ia nā waiwai pale wela maikaʻi a me ka hoʻomaʻamaʻa ʻole, ʻaʻole i ʻino ʻia e nā ʻakika a i ʻole nā alkalines.E like me ka hoʻopaʻa paʻa ʻia ʻana o ka puʻupuʻu nui o Platelet Alumina, hiki iā ia ke hana i kahi ʻili liʻiliʻi maikaʻi loa, hāʻawi iā ia i ka maikaʻi kiʻekiʻe e like me ka abrasive.Me ka nui o ka hoʻohana ʻana, Platelet Alumina he pauka abrasive hiki ke hana i nā hana he nui.
ʻāpana | Māhele Māhele (µm) | |||
ʻāpana nui | Nui ʻāpana | Nui ʻāpana | Nui ʻāpana | |
45 | <82.9 | 53.4± 3.2 | 34.9± 2.3 | 22.8± 1.8 |
40 | <77.8 | 41.8± 2.8 | 29.7± 2.0 | 19.0± 1.0 |
35 | <64.0 | 37.6± 2.2 | 25.5± 1.7 | 16.0± 1.0 |
30 | <50.8 | 30.2± 2.1 | 20.8± 1.5 | 14.5± 1.1 |
25 | <40.3 | 26.3± 1.9 | 17.4± 1.3 | 10.4± 0.8 |
20 | <32.0 | 22.5± 1.6 | 14.2± 1.1 | 9.00±0.80 |
15 | <25.4 | 16.0± 1.2 | 10.2± 0.8 | 6.30±0.50 |
12 | <20.2 | 12.8± 1.0 | 8.20±0.60 | 4.90±0.40 |
9 | <16.0 | 9.70±0.80 | 6.40±0.50 | 3.60±0.30 |
5 | <12.7 | 7.20±0.60 | 4.70±0.40 | 2.80±0.25 |
3 | <10.1 | 5.20±0.40 | 3.10±0.30 | 1.80±0.30 |
ʻAno huahana | Kaumaha Kūikawā | ||||
Al2O3 | SiO2 | Fe2O3 | Na2O | ||
3µm-45µm | >3.90 | >99.0 | <0.20 | <0.10 | <1.00
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1. E hoʻohālikelike me nā pauka papa ʻē aʻe, ʻo ka pauka alumina tabular nā mea hui maikaʻi loa.E like me ka helu heheʻe kiʻekiʻe, ka paʻakikī paʻakikī, ka ikaika mechanical kiʻekiʻe, ka pale ʻana i ka lole maikaʻi, ke kūpaʻa kemika, ka pale ʻana o ka oxidation a me ka pale wela etc.
2. ʻO ke ʻano o ka pepa pālahalaha e hoʻonui ai i ka friction, hoʻomaikaʻi i ka wikiwiki o ka wili ʻana a me ka maikaʻi, hiki ke hoʻemi i ka nui o nā mīkini wili, hana a me ka manawa wili.
3. ʻAʻole maʻalahi ka ʻōpala ʻana o ke ʻano o ka pepa pālahalaha, hiki ke hoʻonui i ka nui o nā huahana kūpono i ka 10% -15%.No ka laʻana, hiki i ka helu o ka wafer silicon semiconductor kūpono ke hoʻokō i 96% a i ʻole.
4. Loaʻa i nā hopena pālua o nā nano a me nā micro powders, ʻoi aku ka haʻahaʻa o ka hana o ka ʻili, ʻaʻole hiki ke hui maikaʻi me nā pūʻulu hana ʻē aʻe, akā ʻaʻole maʻalahi hoʻi e agglomerate a hoʻomaʻamaʻa i ka hoʻopuehu pono.
5. Loaʻa ka hoʻopili maikaʻi, ka hopena pale nui a me ka hiki ke hoʻomālamalama i ka mālamalama.
6. ʻO ka pauka alumina tabular ʻaneʻane akaka, kala ʻole, a he palahalaha a paheʻe ka ʻili.He hexagons maʻamau nā kristal i hoʻoheheʻe maikaʻi ʻia.
7. Hiki ke hana i ka pauka alumina tabular i ka pauka polishing maikai loa.
1. ʻOihana uila: wili a me ka polishing o semiconductor monocrystalline silicon wafers, quartz quartz crystals, compound semiconductors (crystalline gallium, phosphating nano).
2. ʻOihana aniani: ka wili a me ka hana ʻana i ke aniani, ke aniani quartz, ka pale aniani kinescope, ke aniani aniani, ka wai aniani hōʻike (LCD) aniani substrate, a me ka aniani quartz.
3. ʻO kaʻoihana hoʻopili: nā mea hoʻopili kūikawā a me nā mea hoʻopihapiha no ka hoʻoulu plasma.
4. Metal a me ceramic hana hana: precision ceramic mea, sintered ceramic maka mea, kiʻekiʻe-grade kiʻekiʻe-mehana uhi, etc.
Inā he mau nīnau kāu. E ʻoluʻolu e hoʻokaʻaʻike mai iā mākou.