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Nā huahana

Kiʻekiʻe recycling Blasting Media nā nui āpau ʻōmaʻomaʻo silicon carbide pauda maikaʻi gsic no ka polū a me ka wili ʻana


  • kala kala:ʻōmaʻomaʻo
  • maʻiʻo:>98%
  • Minerala kumu:α-SiC
  • ʻAno kristal:Hexagonal kristal
  • Mohs paakiki:3300kg/mm3
  • ʻAiʻi maoli:3.2g/mm
  • ʻAno nui:1.2-1.6g/mm3
  • Kaumaha kiko:3.20-3.25
  • Huahana Huahana

    HOOLAHA

    Hoʻolauna ʻo Green Silicon Carbide

    ʻO ka pauka carbide silicon green kahi mea abrasive kiʻekiʻe i hoʻohana ʻia no nā noi like ʻole e like me ka polishing a me ka sandblasting.Ua ʻike ʻia ʻo ia no kona ʻoi aku ka paʻakikī, ka mana ʻokiʻoki hoihoi, a me ka ikaika ʻoi aku.Hoʻokumu ʻia ka carbide silika ʻōmaʻomaʻo ma ka hoʻomehana ʻana i ka hui ʻana o ke one silica a me ke kalapona i nā wela kiʻekiʻe i loko o ka umu uila.ʻO ka hopena he mea crystalline me kahi kala ʻōmaʻomaʻo nani.

    gsic (58)
    gsic (52)
    gsic (6)

    Na Waiwai Kino Omaomao Silicon Carbide

     

    Waiwai kino
    ʻAno aniani Hexagonal
    ʻAno nui 1.55-1.20g/cm3
    ʻO ka nui o ka palaoa 3.90g/cm3
    Mohs Paʻakikī 9.5
    Knoop Hardness 3100-3400 Kg/mm2
    Ka ikaika wawahi 5800 kPa·cm-2
    kalakala ʻōmaʻomaʻo
    Lae hehee 2730ºC
    ʻO ke kau wela wela (6.28-9.63)W·m-1·K-1
    Ka helu hoʻonui laina (4 - 4.5)*10-6K-1(0 - 1600 C)
    Nui Māhele ʻai Huina Kemika(%)
      D0 ≤ D3 ≤ D50 D94 ≥ SiC ≥ FC ≤ Fe2O3≤
    #700 38 30 17±0.5 12.5 99.00 0.15 0.15
    #800 33 25 14±0.4 9.8 99.00 0.15 0.15
    #1000 28 20 11.5±0.3 8.0 98.50 0.25 0.20
    #1200 24 17 9.5±0.3 6.0 98.50 0.25 0.20
    #1500 21 14 8.0±0.3 5.0 98.00 0.35 0.30
    #2000 17 12 6.7±0.3 4.5 98.00 0.35 0.30
    #2500 14 10 5.5±0.3 3.5 97.70 0.35 0.33
    #3000 11 8 4.0±0.3 2.5 97.70 0.35 0.33

     


  • Mua:
  • Aʻe:

    1. Ka wili a me ka ʻoki ʻana: ka wili pololei ʻana i nā metala paʻakikī, nā mea seramika, a me ke aniani
    2. ʻOi a me ka Honi: ʻOi a honi i nā mea ʻoki ʻoki e like me nā pahi, ʻoki, a me nā lau
    3. Abrasive Blasting: hoʻomākaukau i ka ʻili, hoʻomaʻemaʻe, a me nā noi etching
    4. ʻO ka hoʻopololei a me ka Lapping: ʻO ka poli pololei o nā lens, nā aniani, a me ka semiconductor wafer polishing
    5. ʻO ka ʻili Uea: nā wafer silika, nā pōhaku makamae, a me nā seramika
    6. ʻOihana Refractory a me Ceramic: hana i nā crucibles, kiln lako, a me nā mea wela kiʻekiʻe
    7. ʻOihana Semiconductor:
    8. Hoʻohana Metallurgical

     

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