ʻO ke kuleana wili pololei o ka Brown Fused Alumina Micropowder i ka ʻoihana Semiconductor
E nā hoaaloha, i kēia lā e kamaʻilio kākou e pili ana i kahi mea paʻakikī a me ka haʻahaʻa—pauka alumina i hoʻohuihui ʻia me ka ʻeleʻeleʻAʻole paha ʻoe i lohe i ia mea, akā ʻo nā ʻāpana koʻikoʻi a palupalu loa i kāu kelepona a me ka uaki akamai, ma mua o ko lākou hana ʻia ʻana, ua hana paha me ia. ʻO ke kapa ʻana iā ia ʻo ke "mea hoʻonani nui" o ka ʻāpana ʻaʻole ia he hoʻonui.
Mai noʻonoʻo iā ia he mea hana ʻino e like me ka pōhaku hoʻowali. I ke ao o nā semiconductors, he hana palupalu ia e like me ka micro-sculptor e hoʻohana ana i nā scalpels nanoscale.
I. ʻO ke “Kālai Maka” o ka ʻIpu: No ke aha he mea pono ai ka wili ʻana?
E hoʻomaopopo mua kākou i hoʻokahi mea: ʻaʻole ulu pololei nā ʻāpana ma ka ʻāina pālahalaha. Ua "kūkulu ʻia" lākou ma ka papa ma luna o kahi wafer silicon maʻemaʻe loa (ka mea a mākou e kapa nei he "wafer"), e like me ke kūkulu ʻana i hale. He mau ʻumi papahele o kēia "hale", a ʻoi aku ka lahilahi o ke kaapuni ma kēlā me kēia papahele ma mua o hoʻokahi tausani o ka mānoanoa o ka lauoho kanaka.
Eia ka pilikia: ke kūkulu ʻoe i papahele hou, inā ʻaʻole like iki ke kumu—ka ʻili o ka papahele ma mua—ʻoiai me kahi mea i puka liʻiliʻi e like me ka ʻātoma, hiki iā ia ke hana i ka hale holoʻokoʻa e kekee, pōkole, a hoʻolilo i nā ʻāpana i mea hiki ʻole ke hoʻohana ʻia. ʻAʻole he mea hoʻohenehene nā pohō.
No laila, ma hope o ka pau ʻana o kēlā me kēia papahele, pono mākou e hana i ka "hoʻomaʻemaʻe" a me ka "hoʻohaʻahaʻa ʻana." He inoa nani ko kēia kaʻina hana: "Chemical Mechanical Planarization," i hoʻopōkole ʻia ʻo CMP. ʻOiai ke kani paʻakikī o ka inoa, ʻaʻole paʻakikī ke hoʻomaopopo i ke kumumanaʻo: he hui pū ʻana ia o ka pala kemika a me ka abrasion mechanical.
Hoʻohana ka "punch" kemika i kahi wai hoʻopili kūikawā e palupalu a hōʻino i ka mea e wehe ʻia, e hoʻolilo iā ia i "palupalu."
Hoʻomaka ka "punch" mechanical—pauka corundum ʻeleʻeleʻO kāna hana, ʻo ia ka hoʻohana ʻana i nā ʻano hana kino e "ʻoki" pololei a kaulike i ka mea i "palupalu ʻia" e ke kaʻina hana kemika.
E nīnau paha ʻoe, me ka nui o nā mea abrasive i loaʻa, no ke aha kēia mea kūikawā? ʻO ia kahi e komo mai ai kona mau ʻano kūikawā.
II. "Pauka Micronized ʻAʻole i Micronized Loa": Ke akamai kūikawā o ka Brown Fused Alumina
I loko o ka ʻoihana semiconductor, ʻo ka pauka micronized alumina i hoʻohuihui ʻia i hoʻohana ʻia ʻaʻole ia he huahana maʻamau. He ʻāpana "pūʻali koa kūikawā" ia, i koho pono ʻia a hoʻomaʻemaʻe ʻia.
ʻO ka mea mua, ua paʻakikī ke hana, akā, ʻaʻole me ka hoʻokaʻulua.ʻO ka alumina i hoʻopili ʻia me ka ʻeleʻeleʻO ka paʻakikī o ka daimana ka lua wale nō ia, ʻoi aku ka lawa e lawelawe i nā mea chip i hoʻohana pinepine ʻia e like me ka silicon, silicon dioxide, a me ka tungsten. Akā ʻo ke kī, ʻo kona paʻakikī he paʻakikī "paʻakikī". ʻAʻole e like me kekahi mau mea paʻakikī (e like me ke daimana) he palupalu a maʻalahi hoʻi e haki ma lalo o ke kaomi, mālama ka alumina ʻeleʻele i kona kūpaʻa me ka hōʻoia ʻana i ka ikaika ʻoki, e pale ana i ka lilo ʻana i "mea luku."
ʻO ka lua, ʻo kona nui haiki o nā ʻāpana e hōʻoiaʻiʻo ana i ka ʻoki like ʻana. ʻO kēia ke kumu koʻikoʻi loa. E noʻonoʻo e hoʻāʻo e hoʻopili i kahi jade makamae me kahi puʻu o nā pōhaku o nā nui like ʻole. ʻO nā pōhaku nui e waiho mau ana i nā lua hohonu, ʻoiai ʻo nā mea liʻiliʻi e liʻiliʻi loa paha e hana ai. I nā kaʻina hana CMP (Chemical Mechanical Polishing), ʻaʻole loa kēia e ʻae ʻia. ʻO ka micropowder alumina fused brown i hoʻohana ʻia i nā semiconductors pono e loaʻa kahi hoʻolaha nui o nā ʻāpana haiki loa. ʻO ke ʻano o kēia, ua like ka nui o nā ʻāpana āpau. Hōʻoia kēia e neʻe like nā tausani o nā ʻāpana micropowder ma luna o ka ʻili wafer, e kau ana i ke kaomi like e hana i kahi ʻili kīnā ʻole, ʻaʻole kahi ʻili pockmarked. Aia kēia pololei ma ka pae nanometer.
ʻO ke kolu, he mea "ʻoiaʻiʻo" ia me ke kemika. Hoʻohana ka hana ʻana i nā ʻāpana kemika like ʻole, me nā wahi waikawa a me nā wahi alkaline. He paʻa loa ka pauka alumina ʻeleʻele i hoʻopili ʻia i ke kemika a ʻaʻole ia e pane maʻalahi me nā mea ʻē aʻe i loko o ka wai polishing, e pale ana i ka hoʻokomo ʻana o nā haumia hou. Ua like ia me kahi limahana hana paʻakikī a haʻahaʻa hoʻi—ke ʻano kanaka a nā luna (nā ʻenekinia) e aloha ai.
ʻO ka hā, hiki ke hoʻokele ʻia kona ʻano, e hana ana i nā ʻāpana "pale". Hiki i ka micropowder alumina ʻeleʻele holomua ke hoʻomalu i ke "ʻano" (a i ʻole "morphology") o nā ʻāpana. Ma o kahi kaʻina hana kūikawā, hiki ke hoʻololi ʻia nā ʻāpana me nā ʻaoʻao ʻoi i nā ʻano kokoke i ka poepoe a i ʻole polyhedral. Hoʻemi maikaʻi kēia mau ʻāpana "pale" i ka hopena "grooving" ma ka ʻili wafer i ka wā e ʻoki ai, e hoʻohaʻahaʻa nui ana i ka pilikia o nā ʻōpala.
III. Hoʻohana honua maoli: ʻO ka "Hauʻoli Mālie" ma ka Laina Hana CMP
Ma ka laina hana CMP, ua paʻa pono nā wafers ma kahi e nā chucks vacuum, i lalo ka ʻili, a kaomi ʻia ma luna o kahi pad polishing e wili ana. Hoʻopīpī mau ʻia ka wai polishing e loaʻa ana ka pauka alumina ʻeleʻele i hoʻohui ʻia, e like me ka noe maikaʻi, ma waena o ka pad polishing a me ka wafer.
I kēia manawa, hoʻomaka kahi "heihei kikoʻī" i loko o ke ao microscopic. ʻO nā piliona o nā ʻāpana micropowder alumina i hoʻohui ʻia i ka brown, ma lalo o ke kaomi a me ka wili ʻana, e hana i nā miliona o nā ʻokiʻoki pae nanometer i kēlā me kēia kekona ma luna o ka ʻili wafer. Pono lākou e neʻe like, e like me kahi pūʻali koa i hoʻopaʻa ʻia, e holomua mālie ana, "e hoʻopalahalaha ana" i nā wahi kiʻekiʻe a "e waiho hakahaka ana" i nā wahi haʻahaʻa.
Pono ke kaʻina hana holoʻokoʻa e mālie e like me ka makani puna, ʻaʻole ka ʻino nui. Hiki i ka ikaika nui ke kahakaha a hana paha i nā microcracks (i kapa ʻia ʻo "subsurface damage"); ʻo ka ikaika lawa ʻole e alakaʻi i ka hana haʻahaʻa a hoʻopilikia i nā papa hana hana. No laila, ʻo ka mana pololei ma luna o ka noʻonoʻo ʻana, ka nui o nā ʻāpana, a me ke ʻano o ka brown fused alumina micropowder e hoʻoholo pololei i ka hopena hope loa a me ka hana.
Mai ka hoʻowali mua ʻana o nā wafers silicon, a hiki i ka planarization o kēlā me kēia papa insulating (silicon dioxide), a ma ka hope loa a hiki i ka hoʻowali ʻana o nā plug tungsten a me nā uea keleawe i hoʻohana ʻia no ka hoʻopili ʻana i nā kaapuni, he mea pono loa ka brown fused alumina micropowder ma aneane i kēlā me kēia ʻanuʻu planarization koʻikoʻi. Hoʻopili ia i ke kaʻina hana hana chip holoʻokoʻa, he "hero ma hope o nā hiʻohiʻona."
IV. Nā Pilikia a me ka Wā E Hiki Mai Ana: ʻAʻohe mea maikaʻi loa, ʻoi aku ka maikaʻi
ʻOiaʻiʻo, ʻaʻohe hopena o kēia ala. I ka holomua ʻana o nā kaʻina hana chip mai 7nm a me 5nm a i 3nm a ʻoi aku ka liʻiliʻi o nā nui, ua hōʻea nā koi no nā kaʻina hana CMP i kahi pae "ʻoi loa". Hōʻike kēia i nā pilikia nui aʻe no ka brown fused alumina micropowder:
ʻOi aku ka maikaʻi a ʻoi aku ka like:Nā pauka liʻiliʻi e hiki mai anapono paha e hiki i ka unahi he ʻumi o ka nanometer, me kahi hoʻolaha like ʻana o ka nui o nā ʻāpana me he mea lā i kānana ʻia e ka laser.
Mea hoʻomaʻemaʻe: He mea make nā mea haumia o ka ion metala, e alakaʻi ana i nā koi maʻemaʻe kiʻekiʻe aʻe.
Hana: E puka mai anei nā "micropowders akamai" i ka wā e hiki mai ana? No ka laʻana, me nā ʻili i hoʻololi kūikawā ʻia, hiki iā lākou ke hoʻololi i nā ʻano ʻoki ma lalo o nā kūlana kikoʻī, a i ʻole e hoʻokō i ka hoʻokala ponoʻī, ka lubrication ponoʻī, a i ʻole nā hana ʻē aʻe?
No laila, ʻoiai kona kumu i ka ʻoihana abrasive kuʻuna, ua loli nui ka alumina micropowder brown fused i kona komo ʻana i ke kahua ʻoi loa o nā semiconductors. ʻAʻole ia he "hammer," akā he "nanosurgical scalpel." ʻO ka ʻili laumania maikaʻi loa o ka chip core i kēlā me kēia mea uila holomua a mākou e hoʻohana ai, aia kona ola ʻana i nā ʻāpana liʻiliʻi he nui ʻole.
He papahana nui kēia i mālama ʻia ma ke ao microscopic, apauka alumina i hoʻohuihui ʻia me ka ʻeleʻelehe mea kānalua ʻole he mea hana lima hāmau akā pono e koʻikoʻi i kēia papahana.