Nā Noi Koʻikoʻi a me ka Waiwai ʻOihana o Ultra-Precision/Ultra-Fine Diamond Micropowder
ʻO ka micropowder daimana ultra-precision a me ultra-fine, ʻo ia ka mea paʻakikī loa, ʻoi loa, a hiki ke hoʻokele ʻia ka hoʻolaha nui o nā ʻāpana superhard abrasive i loaʻa i kēia manawa, ke lilo nei i mea koʻikoʻi nui i hiki ʻole ke hoʻololi ʻia i ka hana kikoʻī. Me ka hoʻonui ʻia ʻana o nā koi no ka maikaʻi o ka ʻili, ka pololei o ka hana ʻana, a me ka hilinaʻi o nā mea mai nā ʻoihana e like me optics, electronics, semiconductors, a me ka ikehu hou,pauka daimanaKe neʻe nei mai ka wili kuʻuna a me ka polishing i ka hana ʻana i ka ultra-precision kiʻekiʻe, a ke hoʻonui mau nei kāna laulā noi. ʻO ka laulā o nā ʻāpana micropowder daimana ma waena o 0.1-10 μm, me nā pauka ultrafine submicron a me nano-sized e lilo i mea hoʻopau nui i ka hana ʻana i ka holomua. Loaʻa iā lākou ka paʻakikī Mohs 10 kiʻekiʻe loa, ka conductivity thermal kiʻekiʻe, ka coefficient haʻahaʻa o ka friction, a me nā hiki micro-cutting i hana ʻia i ka wā o ka hana ʻana, e hiki ai ke hoʻopau i ka ʻili atomic-level ma nā mea i hana ʻia. He mea maopopo loa kēia ma ke kahua polishing hope loa o nā aniani optical, sapphire, ceramics, laser crystals, semiconductor wafers, a me nā metala ultrahard, kahi e hōʻike ai lākou i nā pono hiki ʻole ke hoʻololi ʻia.
Ma nā kahua o ka optics a me nā lasers,pauka daimana maikaʻi loaHoʻohana nui ʻia no ka poli ʻana o ke aniani optical, nā kristal infrared, nā puka makani sapphire, nā aniani reflectivity kiʻekiʻe, a me nā kristal laser. Ke koi nei ka ʻoihana optics i ka ʻili kiʻekiʻe loa, e koi pinepine ana iā Ra < 1 nm. ʻO nā ʻaoʻao ʻokiʻoki ʻoi o ka pauka daimana, e hana ana ma ke ʻano hōʻino haʻahaʻa, e hōʻemi pono i nā papa stress a me nā microcracks, e hoʻomaikaʻi ana i ka transmittance māmā a me ka hana optical. I ka hana ʻana o ke aniani kelepona paʻalima sapphire, nā puka makani infrared, nā kānana telecommunication, a me nā aniani resonator laser, nā slurries polishing daimana, nā pads polishing daimana, a me nā hoʻokuʻu daimana he mau mea hoʻopau koʻikoʻi. Eia kekahi, hoʻohana ʻia ka pauka ultrafine i nā kaʻina hana MRF (magnetorheological rheological polishing) a me CMP (chemical mechanical polishing). Ma o ka kaohi ʻana i ka nui o ka ʻāpana kikoʻī a me ka ʻenehana uhi ʻili, ua hoʻokō ʻia ka ʻoki like a me ka poli ʻana haʻahaʻa, e hoʻomaikaʻi nui ana i ka pono hana a me ka hua o nā ʻāpana optical.
I loko o ka ʻoihana semiconductor a me nā mea uila, hoʻopili ʻia ka pauka daimana ultraprecision i ka wili ʻana a me ka poli ʻana o nā wafers silicon, silicon carbide (SiC), gallium nitride (GaN), nā substrates sapphire, a me nā wafers semiconductor compound. Me ka ulu nui ʻana o nā mea mana SiC a me ka ʻoihana semiconductor hanauna ʻekolu, ʻo ka paʻakikī kiʻekiʻe a me ka brittleness o nā wafers e kau i nā koi kiʻekiʻe ma luna o nā mea hoʻopau wili. Hiki i ka Diamond micropowder ke wehe koke i nā mea i ka wā wili a hōʻemi i ka ʻili o ka ʻili i ka pae nanometer i ka wā polishing, e hoʻemi ana i ka pōʻino o ka ʻili a pēlā e hoʻomaikaʻi ai i ka hua o ka mea hana a me ka hana hoʻoheheʻe wela. I loko o ka ʻoihana panela hōʻike, hoʻohana nui ʻia ka diamond micropowder no ka poli ʻana ultra-precision o nā uhi aniani, ke aniani uaki, ke aniani uhi 3D, a me nā ʻāpana optical AR/VR. Hiki i kona pono hana kiʻekiʻe ke hoʻopōkole i ke kaʻina hana hoʻoheheʻe, hoʻomaikaʻi i ke kūlike o ka huahana, a hoʻomaikaʻi nui i ka hua o ka laina hana a me ka manawa pōʻaiapuni.
Ma nā kahua paʻakikī kiʻekiʻe e like me ka carbide cemented, keramika, a me nā composites matrix metala, hoʻohana nui ʻia ka micropowder daimana ultrafine no ka wili pololei ʻana o nā kihi o nā mea hana, ka polishing pololei o nā molds, ka hoʻoikaika ʻana i ka ʻili o nā ʻāpana kūkulu aerospace, a me ka hoʻokumu pololei ʻana. ʻOiai hiki i nā mea hana carbide cemented ke hoʻomaikaʻi i ke kūpaʻa ʻana i ka ʻaʻahu a me ke ola ʻokiʻoki ma hope o ka passivation lihi a me ka polishing.pauka daimana hiki ke hoʻokō i ka ʻoki liʻiliʻi me ka mālama ʻana i ka ʻoi, e hopena ana i kahi microstructure like a puni ma ka ʻaoʻao ʻoki. I loko o ka ʻoihana hoʻoheheʻe kikoʻī, e like me nā hoʻoheheʻe injection, nā hoʻoheheʻe make-casting, a me nā hoʻoheheʻe optical, hiki i ka polishing pauka diamond micron ke hoʻokō i nā hopena aniani sub-nanometer, e hoʻomaikaʻi nui ana i ke ola hoʻoheheʻe, ka hana demolding, a me ka maikaʻi o ka hoʻoheheʻe ʻana. I loko o nā ʻoihana kaʻa, aerospace, a me nā lako ikehu, hoʻohana ʻia ka pauka diamond micron no ka wili ultra-precision o kekahi mau mea kūikawā, e like me nā ʻāpana turbine keramika paʻakikī, nā superalloys nickel-based, a me nā composites carbon fiber, e hāʻawi ana i nā ʻāpana i ka hilinaʻi kiʻekiʻe a me ka paʻa o ka hana.
I ka hoʻomau ʻana o nā kahua noi e hoʻonui, ke hoʻomaikaʻi mau ʻia nei ka ʻenehana hoʻomākaukau o ka pauka micron daimana ultra-precision. I kēia manawa, ʻo nā ʻano hoʻomākaukau nui e pili ana i ka hana ʻana i ka daimana hana kiʻekiʻe, ka detonation (nanodiamond), nā ʻano kemika, a me nā ʻenehana hoʻololi ʻili. No ka hoʻokō ʻana i nā koi kiʻekiʻe no ke kūpaʻa a me ka hoʻokuʻu ʻana i nā ʻoihana optics a me semiconductor, ua uhi pinepine ʻia ka pauka micron kiʻekiʻe, e like me nā metala, nā inorganics, nā organics, a me nā surfactants, no laila e hoʻomaikaʻi ana i ka dispersibility, ke kūpaʻa wela, a me ke kūlike o ka hana ʻana. Ke pani mālie nei ka daimana ultrafine-grained i nā kuʻuna.nā mea hoʻowalie like me ka cerium oxide a meʻaluminai nā kaʻina hana CMP, e hoʻomaikaʻi hou aku i ka palahalaha a me ka hana pono o nā wafers a me nā ʻāpana optical. I ka wā e hiki mai ana, me ka hoʻomohala ʻana o ka hana akamai, ka kamaʻilio quantum, nā mea lapaʻau pololei a me nā mea optoelectronic holomua, e hoʻomau ka pauka micro daimana ultra-precision i ka hoʻonui ʻana i kona mau palena noi a lilo i mea nui koʻikoʻi i ka ʻoihana hana mea.