Hana ʻia ka Monocrystalline Diamond Powder mai nā hua abrasive kristal hoʻokahi daimana hana ma ke ʻano kaomi static, kahi i kuʻi ʻia a hoʻohālike ʻia me ka hoʻohana ʻana i kahi kaʻina hana kūikawā no nā mea paʻakikī loa. Mālama kona mau ʻāpana i nā waiwai kristal hoʻokahi o ka daimana kristal hoʻokahi.
| Nā kikoʻī | D50 (μm) | Nā kikoʻī | D50 (μm) |
| 0-0.05 | 0.05 | 5-10 | 6.5 |
| 0-0.08 | 0.08 | 6-12 | 8.5 |
| 0-0.1 | 0.1 | 8-12 | 10 |
| 0-0.25 | 0.2 | 8-16 | 12 |
| 0-0.5 | 0.3 | 10-20 | 15 |
| 0-1 | 0.5 | 15-25 | 18 |
| 0.5-1.5 | 0.8 | 20-30 | 22 |
| 0-2 | 1 | 20-40 | 26 |
| 1-2 | 1.4 | 30-40 | 30 |
| 1-3 | 1.8 | 40-60 | 40 |
| 2-4 | 2.5 | 50-70 | 50 |
| 3-6 | 3.5 | 60-80 | 60 |
| 4-8 | 5 |
ʻO ka pauka daimana polycrystalline he mau ʻāpana polycrystalline micron a me sub-micron i haku ʻia me nā hua daimana me ke anawaena o 5 ~ 10nm i hoʻopaʻa ʻia ma o nā pilina unsaturated. He isotropic ka loko a ʻaʻohe ona mokulele cleavage. Loaʻa iā ia ka paʻakikī kiʻekiʻe. Ma muli o kona mau ʻano hoʻonohonoho kūikawā, hoʻohana pinepine ʻia no ka wili ʻana a me ka hoʻopili ʻana i nā mea semiconductor, nā keramika pololei, a pēlā aku.
Eia nā nui i loaʻa o ka pauka micro diamond:
Nā ʻano huahana
Hoʻokumu ʻia ka pauka daimana nano me nā kristal liʻiliʻi ma lalo o 20 nanometer, ʻo ke kūlana detonative kūikawā e hana i ka daimana i ʻano poepoe me ka hui hana waiwai ma luna o ka ʻili, ua hoʻonui ʻia kona ʻāpana ʻili kikoʻī e hoʻokahi kauoha o ka nui i hoʻohālikelike ʻia me ka daimana monocrystalline. ʻAʻole wale kēia huahana i loaʻa nā ʻano paʻakikī maikaʻi loa a me ka wili ʻana o ke daimana, akā loaʻa pū kekahi nā ʻano hou o nā mea nanofunctional.
| Nā nui | ND50 | ND80 | ND100 | ND120 | ND150 | ND200 | ND300 | ND500 | ND800 |
| D50(nm) | 45-55 | 75-85 | 90-110 | 110-130 | 140-160 | 180-220 | 280-320 | 450-550 | 750-850 |
Nā ʻano
1. Kūpono no nā uea daimana electroplated kiʻekiʻe like ʻole, nā huila wili daimana electroplated, ka ʻoki ʻana i ke aniani SiC, nā pahi, nā pahi ʻoki lahilahi loa, a pēlā aku.
2. Kūpono no nā pepa hui daimana, nā huahana polycrystalline daimana a me nā huahana hoʻopaʻa metala, nā huahana hoʻopaʻa seramika, nā huahana daimana electroplated, a pēlā aku.
3. Kūpono no nā mea hana daimana electroplated, nā huila wili, a me nā mea ʻē aʻe i hoʻohana kūikawā ʻia no ka hana ʻana i nā mea paʻakikī a palupalu.
4. Kūpono no ka wili pololei a me ka poli ʻana o nā makamae kikoʻī kiʻekiʻe, nā aniani, nā mea hoʻopau metallographic, nā panela LCD, ke aniani LCD, ka sapeiro, nā pepa quartz, nā substrates sapeiro LED, ke aniani LCD, nā mea seramika, a pēlā aku.
1. Lahilahi a me ka poli ʻana o nā wafers semiconductor, e like me ka wafer SiC a me ka sapeiro
2. Ka hoʻopili ʻana i ka ʻili o nā mea keramika like ʻole
3. Ka hoʻopili ʻana i nā mea metala, e like me ke kila kila, ka alumini metala a pēlā aku
1. Hoʻopili maikaʻi loa. Hiki i ka ʻili o nā ʻāpana hana i hoʻopili ʻia ke piʻi i ka pae angstrom me ka ʻole o nā ʻōpala, hiki ke hoʻokō i nā koi noi hoʻopili paʻakikī loa.
2. Hiki ke hoʻohana ʻia ka nano daimana ma ke ʻano he mea hoʻohui aila lubricating. E hoʻololi ʻia ka friction paheʻe i ka friction ʻōwili, hiki ke hoʻemi i ke coefficient friction a hoʻomaikaʻi nui i ka hana friction a hoʻolōʻihi i ke ola lawelawe.
3. ʻO ka uhi ʻana i nā mea hana like ʻole a me ka pīpī ʻana ma luna o ka ʻili o nā ʻāpana hana like ʻole, hoʻoikaika i ke kūpaʻa ʻana i ka ʻaʻahu, ke kūpaʻa i ka pala, ka paʻakikī o ka hopena a me ka paʻakikī o ka ʻili o nā ʻāpana hana.
4. Ma ke ʻano he mea hoʻohui i ka laholio a me nā palakiko, hiki i ka nano daimana ke hoʻonui nui i kona kūpaʻa ʻana i ka ʻaʻahu, ke kūpaʻa ʻana i ka puncture, ka waiwai tensile a hoʻolohi hoʻi i ke kaʻina hana ʻelemakule.
5. ʻAʻole e hōʻole ʻia ke daimana nano maʻemaʻe kiʻekiʻe i nā mea olaola, akā hiki ke hoʻohana nui ʻia i nā ʻoihana lapaʻau, olaola a me nā mea hoʻonani ma muli o kona ʻili nui a me ka hiki ke hoʻopili ʻia.
Inā he mau nīnau kāu. E ʻoluʻolu e hoʻokaʻaʻike mai iā mākou.